Case studies / Selected experience
Engineering experience.
Real hardware challenges.
Selected projects from our lead engineer’s professional experience, including work before LEVCOM. These examples describe individual engineering contributions, with customer identities omitted.
01 / Project experience
Satellite Digital Beamforming Platform
- Challenge
- Integrate high-throughput FPGA subsystems for a Ka-band satellite communications platform.
- Engineering contribution
- FPGA subsystem development and integration, AXI control, scheduling and hardware bring-up.
- Technologies
- JESD204C · Interlaken · AXI · FPGA bring-up
- Result
- Integrated the digital beamforming subsystems with control and scheduling logic.
02 / Project experience
ASIC-to-FPGA Architecture Conversion
- Challenge
- Adapt an ASIC-oriented 400 MHz pipeline to a 200 MHz FPGA implementation.
- Engineering contribution
- Restructured the pipeline around wider datapaths and parallel execution.
- Technologies
- Microarchitecture · Parallel datapaths · FPGA resource optimization
- Result
- Converted the architecture to operate at the lower FPGA clock frequency.
03 / Project experience
100G-Class SERDES Verification
- Challenge
- Verify a 106 Gbps PAM4 SERDES subsystem and support FPGA transceiver integration.
- Engineering contribution
- Built a SystemVerilog/UVM verification environment and supported transceiver integration.
- Technologies
- SystemVerilog · UVM · PAM4 · SERDES
- Result
- Delivered a subsystem verification environment and integration support.
04 / Project experience
High-Performance Camera SoC
- Challenge
- Verify a large-scale camera and image-processing SoC for a production imaging platform.
- Engineering contribution
- Contributed to SoC verification across the camera and image-processing design.
- Technologies
- SoC verification · Camera systems · Image processing
- Result
- Supported verification of a SoC used in a production imaging platform.
05 / Project experience
FPGA-Controlled Mixed-Signal Interface
- Challenge
- Connect FPGA control, embedded software and hardware diagnostics for a high-speed mixed-signal device.
- Engineering contribution
- Developed FPGA control logic, register architecture, embedded drivers and Python bring-up tools.
- Technologies
- FPGA control · Register interfaces · Embedded drivers · Python
- Result
- Delivered the control and diagnostic components for hardware bring-up.
06 / Project experience
DDR & mDDR Memory Test Systems
- Challenge
- Evaluate DDR and mobile DDR (mDDR) memory in board-mounted configurations representative of system operation.
- Engineering contribution
- Developed memory tester systems at Samsung Electronics and performed board-mounted DDR and mDDR testing, connecting test-system design with hardware validation.
- Technologies
- DDR · mDDR · Memory test systems · Board-mounted testing
- Result
- Built practical experience in memory test-system development and validation under board-mounted operating conditions.
07 / Project experience
Wafer EDS & Package-Level Probe Testing
- Challenge
- Test memory devices through probe-based access at wafer EDS and package stages.
- Engineering contribution
- Worked on wafer-level EDS (Electrical Die Sorting) and package-level probe testing at Samsung Electronics, including memory test methods and probe-based electrical evaluation.
- Technologies
- Wafer EDS · Package testing · Probing · Memory electrical characterization
- Result
- Gained hands-on test experience across wafer, package and system-level memory evaluation.